MC-1 Applications

MODUL-CONTACTS MC-1

1:

The PCB is first automatically assembled with the
module contacts using a pick and place system and then reflow soldered.


2:

Subsequently, the single PCB is separated from the
carrier plate and the soldered contacts are bent 90 degrees upwards.

1:

The PCB is first automatically assembled with the
module contacts using a pick and place system and then reflow soldered.


2:

Subsequently, the single PCB is separated from the
carrier plate and the soldered contacts are bent 90 degrees upwards.

3:

Now you can place the PCB in the suitable housing unit.



4:

The next step is filling with the potting compound
and subsequent curing.