MODUL-CONTACTS MC-1
1:
The PCB is first automatically assembled with the
module contacts using a pick and place system and then reflow soldered.
2:
Subsequently, the single PCB is separated from the
carrier plate and the soldered contacts are bent 90 degrees upwards.
1:
The PCB is first automatically assembled with the
module contacts using a pick and place system and then reflow soldered.
2:
Subsequently, the single PCB is separated from the
carrier plate and the soldered contacts are bent 90 degrees upwards.
3:
Now you can place the PCB in the suitable housing unit.
4:
The next step is filling with the potting compound
and subsequent curing.
